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2 products in this product line

57 Series

ATX Mid Tower

TAC 2.0 Thermally Advantaged Chassis

  • Mid Tower YY-5708

    • Mid Tower YY-5708

    Mid Tower YY-5708
    Mid Tower YY-5708
     

    Overview

    A full glossy black bezel with FPIO on top of chassis to make the whole chassis look elegant. For security, the chassis has a standard bracket for pad lock and mounting holes reserved for Kensington slot lock.

    Additional files

    ManualStructureSpec
     

    Special Design

    Thermal Solution

    • The TAC 2.0 Guide specifies 110mm x 150mm vent width an effective open area of 60%
    • TAC 2.0 does not require a duct or any new additional system fans

    Specifications

    SPECIFICATIONS
    Module YY-5708
    Case dimension 190mm W x 438mm D x 420mm H
    Motherboard configuration ATX
    Drive configuration 4 - 5.25"
    1 - 3.5" For FDD or Card Reader
    4 - 3.5" For HDD
    Optional system cooling fans 1*8cm or 9cm or 12cm fan for rear-mounted
    1*12cm for front-mounted
    Expansion slots and ports Standard PCI 7 slots
    Front panel control Power switch, Power LED, HDD LED
    USB 2.0 x 2 (or USB 3.1 gen 1 x 2, USB 3.1 gen 1 x 2 + USB 2.0 x 2, USB 2.0 x 4) + HD Audio
    Multi-function Card reader (Optional)
    Materials Recyclable materials
    94HB ABS, t0.6 SECC steel
    Net Weight 5.5kgs / 12.1lbs without PSU
    Color Black
    Power Supply ATX12V 300W-550W
    Options Cooling fan, USB/Audio/IEEE1394, Multi-function Card reader,
    TAC 2.0 Air Guide solution
    Packing /Shipping 480pcs/20'container
    976pcs/40' container
    1100pcs/40HQ container
    Mid Tower YY-5708
    Mid Tower YY-5708
    Q'ty :
    Inquiry+ Detail
  • Mid Tower YY-5709

    • Mid Tower YY-5709

    Mid Tower YY-5709
    Mid Tower YY-5709
     

    Overview

    A quality chassis to meet Intel thermal requirement. The reusable metal cover with excellent EMI shielding for all exposed drive bays. The quick assembly fastened kits to shorten the assembly time.

    Additional files

    ManualStructureSpec
     

    Special Design

    Thermal Solution

    • The TAC 2.0 Guide specifies 110mm x 150mm vent width an effective open area of 60%
    • TAC 2.0 does not require a duct or any new additional system fans

    Specifications

    SPECIFICATIONS
    Module YY-5709
    Case dimension 190mm W x 438mm D x 420mm H
    Motherboard configuration ATX
    Drive configuration 4 - 5.25"
    2 - 3.5" For FDD or Card Reader
    4 - 3.5" For HDD
    Optional system cooling fans 1*8cm or 9cm or 12cm fan for rear-mounted
    1*12cm for front-mounted
    Expansion slots and ports Standard PCI 7 slots
    Front panel control Power switch, Power LED, HDD LED
    USB 2.0 x 2 (or USB 3.1 gen 1 x 2, USB 3.1 gen 1 x 2 + USB 2.0 x 2, USB 2.0 x 4) + HD Audio
    Multi-function Card reader (Optional)
    Materials Recyclable materials
    94HB ABS, t0.6 SECC steel
    Net Weight 5.5kgs / 12.1lbs without PSU
    Color Black
    Power Supply ATX12V 300W-550W
    Options Cooling fan, USB/Audio/IEEE1394, Multi-function Card reader,
    TAC 2.0 Air Guide solution
    Packing /Shipping 480pcs/20'container
    976pcs/40' container
    1100pcs/40HQ container
    Mid Tower YY-5709
    Mid Tower YY-5709
    Q'ty :
    Inquiry+ Detail

Feature

  • Screw less Drive Bay with quick assembly fastener kits
  • Meet Intel thermal requirement
  • Quick Add-on-card fixing
  • Reusable metal cover with excellent EMI shielding for all exposed drive bays
  • Front access USB 2.0 with USB 3.0 & HD Audio optional
  • USB 3.0 - referred to as USB 3.1 gen 1 on 2015
  • Low acoustic level, Excellent ventilation & EMI containment
  • Optional Intrusion switch for system security
  • Optional Air guide for thermal solution

Special Design